Hey all-

        We just had a selective solder machine installed.  The guy who set it up
set the pot temp. at 310 C (590 F).  I had always understood that there was
a temperature where the tin and lead start to separate, around 510 F.  Is
this inaccurate?  What is the temperature of separation?

-Ryan Jennens
TelGen Corporation
(517) 887-6666 x151

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ralph Richart
Sent: Thursday, June 08, 2000 12:55 PM
To: [log in to unmask]
Subject: [TN] still confused


We have answers....

So I had a long talk with my customer this morning to provide input
based on the invaluable advice from you all.

I said - "is there a specific reason for choosing 3-8u" of immersion
gold over tin/lead solder?"
He said - "absolutely, the gold provides corrosion resistance, the gold
does not"
I said - "even such a thin amount - only 3-8u"?"
He said - "definitely, all we need is the coverage, the thickness is
irrelevant"

Is this true?

Needless to say, we are rebuilding the parts as we speak.  Rework sounds
difficult to say the least, although I may try to come up with some
scheme for fun as they have a bunch of boards that are no good right
now.

thanks for all the help.....

ralph

PS - more on the larrylobster story later; it's more silly than anything
else.  Paul's poem may soon become our own, however.  Very funny!

Off to build some boards....

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