Sender: |
|
Subject: |
|
From: |
|
Date: |
Thu, 15 Jun 2000 11:56:37 +0200 |
Content-Type: |
text/plain; charset="ISO-8859-1" |
MIME-Version: |
1.0 |
Reply-To: |
|
Parts/Attachments: |
|
|
Hi, we had this topic some time ago. I happened to open one of my notebooks and found two very good articles for someone who wished more, forgot who he/she was. Sorry for delay..
1. "Dendritic growth of silver in I.C. packages" by Lieberman and Brodsky/ AMD
2."Failure Analysis Techniques applied in resolving MCM reliability problems" by G.H.Ebel at Singer Kearfott
Unfortunately, I have no adresses to these gentlemen, but clever as you are all, you'll find yourself. I can copy the reports and send them off-mail, of course, but could be too much if more people want them.
Ciao
Ingemar Hernefjord
Ericsson Microwave Systems
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|