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June 2000

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TechNet <[log in to unmask]>
Subject:
Failure Rate for Reflow Process
From:
Becerra Alejandro <[log in to unmask]>
Date:
Fri, 9 Jun 2000 09:17:15 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Becerra Alejandro <[log in to unmask]>
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Good morning Technet members,

I have a question about failure rates for reflow process.
Can someone tell me if there is a benchmark failure rate for a QFP (20 mil
pitch).
It is soldered over a FR-4 board with HASL coating. The reflow ambient is
nitrogen.

Thanks


Alejandro Becerra
Phone (915)841-8518,  Fax (915)841-8401
[log in to unmask]

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