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Thu, 8 Jun 2000 14:15:57 -0500 |
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Donn,
You may want to start with the following AMP web site:
http://www.amp.com/products/technology/articles/dd66.stm
Honeywell
Peter A. Phillips, Sustaining Engineer
Manufacturing Engineering
Home and Building Controls
8500 Bluewater Road N.W.
Albuquerque, NM 87121-1958
Pho 505-831-7509
Fax 505-836-4834
[log in to unmask]
-----Original Message-----
From: Steffen, Don E [mailto:[log in to unmask]]
Sent: Thursday, June 08, 2000 12:31 PM
To: [log in to unmask]
Subject: [TN] PROCESS/DESIGN GUIDELINES FOR STENCILS
TECHNET
Does anybody have stencil/process design guidelines for implementing paste
thru-hole technology? We have a multipin connector we would like to reflow
instead of solderwave. Any comments or pointers would be greatly
appreciated.
Donn Steffen
Wk# (219)925-8887
Fax# (219)925-8710
Email: [log in to unmask]
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