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June 2000

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TechNet <[log in to unmask]>
Subject:
PROCESS/DESIGN GUIDELINES FOR STENCILS
From:
"Steffen, Don E" <[log in to unmask]>
Date:
Thu, 8 Jun 2000 13:26:26 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, "Steffen, Don E" <[log in to unmask]>
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TECHNET

Does anybody have stencil/process design guidelines for implementing paste
thru-hole technology?  We have a multipin connector we would like to reflow
instead of solderwave.  Any comments or pointers would be greatly
appreciated.

Donn Steffen
Wk# (219)925-8887
Fax# (219)925-8710
Email: [log in to unmask]

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