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Thu, 8 Jun 2000 09:38:24 -0700 |
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Barry,
Although I have not done a lot of wave and reflow oven
profiling there are two other systems to consider. One
is Datapaq and the is Kic. I use a datapaq for BGA
profiling and I find it and it software to meet my
needs.
As far profiling wave and reflow a few things to
consider are:
Leading and trailing edges.
Uniformity of heat across the circuit(s).
Max temps for the assorted device (typically 210C
+/-).
Thermal Couple placement - critical devices (high pin
count - BGA's); heavily populated area (leading and
trailing edges).
As far as tooling:
Based on the complexity of the technology of the
circuits your building you may want to consider using
pallets, finger guards etc. I am not sure of the name
of pallet mfg. some one else reading this may.
Time vs Temp:
Profiling in a nut shell is the achieving a
temperature of +183C for about 30 to 60 across the
circuit. The dwell time will vary depending on the
circuit. The 30 to 60 second margin is what I use for
BGA repairs.
Fluxes and chemistries:
Things to consider are spray versus bubble fluxers.
No Clean versus RMA solder and fluxes.
Addreses www.datapaq.com
www.kicthermal.com
Hope this helps,
Tony Di Mauro
Circuit Technology Center
Haverhill, MA
--- Lee Whiteman <[log in to unmask]> wrote:
> Barry Gallegos,
>
> You may want to check out ECD's website on their
> MOLE. The MOLE is used to
> capture thermal profile's. ECD's website is:
> http://www.ecd.com/emfg/instruments/mole/.
>
> For more information, you may want to check out SMT
> Magazine's website on
> soldering. Their website is:
> http://www.smtmag.com/Step-by-StepSMT/Step7.html.
>
> I can provide additional information directly to
> you, so you can learn this
> "art". Give me a call with your telephone number,
> fax number, and E-Mail, so
> I can get this data to you.
>
> Lee Whiteman
> Senior Manufacturing Engineer
> ACI / EMPF
> Telephone: (610) 362-1200; Ext. 208
> FAX: (610) 362-1290
> E-Mail: [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf
> Of Barry Gallegos
> Sent: Tuesday, June 06, 2000 5:50 PM
> To: [log in to unmask]
> Subject: [TN] Thermal Profiling
>
>
> Once Again, (if I may)
>
>
>
> I am attempting to learn how to profile both
> wave and reflow. I have
> absolutely no experience.
>
>
>
> Please where can I go to lean this art.
>
>
>
> Barry Gallegos.
>
>
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