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Wed, 7 Jun 2000 18:49:15 -0700 |
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The items that they want to be gold are actual features on the board, not edge
connectors or anything like that.
I don't know why they want gold rather than solder. I can only assume that it has
something to do with the environment or application. But, I would guess that tin/lead
could withstand as much as 3-8u" of gold.
The boards are already populated, so I assume it's not a planarity issue.
ralph
"Howieson, Rick" wrote:
> Ralph,
> Ain't gonna happen and why would they want this?
> Rick
> GTC
>
> >-----Original Message-----
> >From: Ralph Richart [SMTP:[log in to unmask]]
> >Sent: Wednesday, June 07, 2000 5:29 PM
> >To: [log in to unmask]
> >Subject: [TN] Loaded board rework
> >
> >Hello:
> >
> >Our customer made a mistake on their print. Instead of specifying
> >immersion gold, they specified Hot Air Solder Levelled. Now they have
> >LOADED boards that they want to get immersion gold on.
> >
> >Has anyone done this? The questions I have off the top of my head are:
> >1. How do you protect the components from the immersion gold? Would
> >conformal coat work?
> >2. Do you have to strip the solder first, or can you go gold over
> >solder?
> >3. What, if anything, would all this do to reliability?
> >
> >Thanks for your help....
> >
> >ralph richart
> >
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