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June 2000

DesignerCouncil@IPC.ORG
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DesignerCouncil <[log in to unmask]>
Subject:
Dielectric thickness
From:
Chris Robertson <[log in to unmask]>
Date:
Mon, 12 Jun 2000 11:07:20 -0500
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Chris Robertson <[log in to unmask]>
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I normally treat layer to layer distance (finished) the same as the trace to
trace limits for voltage requirements.
In other words if a trace needs to be 16 mils apart (internal) than the
layers need to have a 16 mil from copper to copper.

Is this overkill? I've not found a page in the IPC spec that specifically
address this. Does anyone have an idea? Spec?

Chris Robertson
Designer
Lockheed - Martin Services, Inc.
4912 Research Dr.
Huntsville, AL 35805
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Ph/Fax (256) 722-2626
ICQ# 13541566

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