In a message dated 05/05/2000 9:45:18 AM US Eastern Standard Time,
[log in to unmask] writes:

> What are the material impacts of moving to J-STD-001 from the Mil-Std-2000?
>  Specifically, solder and flux, would procurement of new materials
certified
> to J-STD-00X be required or can QQ--S-571/Mil-F-14256 materials be used?

Richard,
This is far too broad a question to be answered reasonably here.  You still
have to understand the materials and processes that you are using.  You still
have to do testing to demonstrate that your materials are compatible with
each other.  You still have to produce hardware that meets your customers
requirements.

In my estimation, the biggest difference between J-STD-001C and MIL-STD-2000A
is the philosophy.  MIL-STD-2000A was the last of the "thou shalt do it thus
and so, or else" specifications.  J-STD-001C is predicated on the "we don't
care how you make it, it just has to work to our specifications" approach.
It does not specify what kinds of testing you have to do to demonstrate
compatibility.  That's up to you.

You need to use a flux/paste/cored wire solder that is qualified to
J-STD-004.  If you choose to not use a flux/paste/cored wire solder that is
not qualified to J-STD-004, you have to have objective evidence on fhand that
the combination is compatible and not detrimental to reliability.  So the
question of "can I use material X" can be answered with "sure, provided you
have the data to back it up".

I did a paper in years past on qualifying a process to J-STD-001B, and the
approach is still pretty much the same for the C revision, although I am
currently reading through Rev C to make sure of this.  If I recall correctly,
I turned it over to IPC as a white paper.  It was titled "The Layman's Guide
to Qualifying a Process to J-STD-001B".  It might answer some of your
questions.

Doug Pauls
Technical Director
CSL

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