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May 2000

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Subject:
From:
Jim Kittel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 May 2000 09:20:56 -0600
Content-Type:
text/plain
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text/plain (96 lines)
Steve,

Thanks for the heads up.  BGA's are 'spooky' to some folks (test people,
program managers, etc.) anyway because they can't 'see what they got'.  It
has been an uphill battle to develop success and instill confidence in their
use.  Sure don't want to walk blindly into a bad experience.

Jim Kittel




        -----Original Message-----
        From:   Stephen R. Gregory [SMTP:[log in to unmask]]
        Sent:   Thursday, May 04, 2000 7:44 PM
        To:     [log in to unmask]
        Subject:        [TN] Texas Instrument BGA's...

        Hey ya'll,

        I finally talked to an engineer from Texas Instruments about the
problems
        with their BGA's (PN# TMS320C6201GJC200), and expected the "song and
dance"
        that I got.

        The person that I spoke with first stated that from their tests
there weren't
        any manufacturability issues with the part, but when I spoke about
hearing
        first hand that there have been shorting problems unless the part
was
        "shimed", the person I was speaking with said that there has been
some
        problems reported from users to that effect (he first denied any
such
        problems), but he told me that the problems that he knew of, was
because the
        BGA location was in the center of the board, and was susceptable to
the
        bridging problem because of the fab warping during reflow...I don't
buy that.

        I asked if Texas Instruments was doing anything to address the
issue, such as
        high temp balls, and he said no...because there isn't a problem with
the
        part. He also stated that there isn't a need for x-ray with this
part;
        "because of the self-centering" characteristics that the part has.
He also
        stated that the balls will be collapsed more because of the added
weight of
        the heat sink...sheesh! Tell me something I don't know!

        I wanted to know what I could do to prevent from having to rework
this BGA
        due to bridging, and what, if anything, Texas Instruments was doing
to
        address the issue.

        I might as well have been talking to a wall...

        -Steve Gregory-

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