Steve,
When I spoke with a TI packaging engineer last year he had indicated that
repackaging the part with a smaller die, smaller case, etc. was an option
being looked at. Sounds like that's no longer the case, or they'd rather
not discuss it due to liability concerns.
Guess we're on our own for now.
Rick Thompson
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen R. Gregory
Sent: Thursday, May 04, 2000 6:44 PM
To: [log in to unmask]
Subject: [TN] Texas Instrument BGA's...
Hey ya'll,
I finally talked to an engineer from Texas Instruments about the problems
with their BGA's (PN# TMS320C6201GJC200), and expected the "song and dance"
that I got.
The person that I spoke with first stated that from their tests there
weren't
any manufacturability issues with the part, but when I spoke about hearing
first hand that there have been shorting problems unless the part was
"shimed", the person I was speaking with said that there has been some
problems reported from users to that effect (he first denied any such
problems), but he told me that the problems that he knew of, was because the
BGA location was in the center of the board, and was susceptable to the
bridging problem because of the fab warping during reflow...I don't buy
that.
I asked if Texas Instruments was doing anything to address the issue, such
as
high temp balls, and he said no...because there isn't a problem with the
part. He also stated that there isn't a need for x-ray with this part;
"because of the self-centering" characteristics that the part has. He also
stated that the balls will be collapsed more because of the added weight of
the heat sink...sheesh! Tell me something I don't know!
I wanted to know what I could do to prevent from having to rework this BGA
due to bridging, and what, if anything, Texas Instruments was doing to
address the issue.
I might as well have been talking to a wall...
-Steve Gregory-
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
