A mere four months away, IPCWorks 2000 will be the host for a number of paper sessions hightlighting both alternative surface finishes for the PWB industry as well the latest information on the lead-free initiative. If you have an interest in presenting a paper during our fall conference this September, please read through the following Call for Papers, which describes all the areas for which papers are being sought and how to submit them:
CALL FOR PAPERS
IPCWorks 2000:
HASLs of Assembling in the New Millenium
Hyatt Regency Miami s September 9 - 15, 2000
Who's blowing hot air on my HASL?
The search for finality on final finishes
Soldering has a 2000 year history, so what better way to celebrate the year 2000 than with the issues that will face assembly and soldering in the PWB industry in the 21st Century.
Remember the good ol' days when bigger was always better? Those days are long since gone now, especially when constantly being called upon to build reliable product that is smaller than ever before.
With the drive for placing fine pitch components on smaller conductors, one would think we would be asking hot air solder leveling (HASL) what it wants on its tombstone. Even though the industry seems to be moving away from this process, however, nearly 75% of PWB manufacturers continue to use it to build quality product.
If HASL were to disappear, where would we turn to? What are the best alternative platings? How would its disappearance affect processes and reliability with regards to solderability and bondability? If one only had a crystal ball.
This pump serves unleaded only
Building off of last years lead-free initiative
Whew, a lot has happened in the past year. An industry lulled to sleep from exemption from lead elimination legislation in the early '90s was suddenly hit with a splash of cold water. Pending legislation in Europe and marketing ploys by Japanese OEMs forced the U.S. PWB industry to take a new look at lead-free electronics. At an estimated cost of somewhere in the billions of dollars, U.S. manufacturers are researching the issue and their options and drawing assessments on what is most feasible for their company and products.
A year has passed since IPCWorks '99, An International Summit on Lead-Free Electronics Assemblies, which drew over 400 people from across the globe to gather the information and decide whether or not to tread the "green path." As a follow up, IPCWorks 2000 will feature a one-day, one-track session on what has occurred in the past year. Topics of this session will include an update on pending legislation and activities in Japan, reports from companies producing lead-free product and forecasting for the years to come.
PAPERS ARE SOUGHT IN ALL AREAS INCLUDING:
HASL
MATERIALS
· Innovations with alternative metals
(Au/Ni, Pd,/Ni, etc.)
· Component lead to surface finish interactions
· Organic Solderability Preservatives (OSPs)
PROCESSES
· Deposition processes
· Assembly-related issues
TESTING AND RELIABILITY
· Testing and analysis
(SERA, Wetting Balance, etc.)
· End product requirements
(Final assembly or PWB)
· Reliability data
LEAD FREE
MATERIALS
· Alloys
· PWB Finishes
· Components
LEGISLATIVE UPDATES
· Waste Electrical and Electronic Equipment
(WEEE) Directive
· EPA
· US / State Legislation
· Japanese Take on Back Legislation
FIELD DATA / MARKET DRIVERS
· Field data for existing product
· Saleable product
· Reliability Data
PRESENTATIONS AND WORKSHOPS:
Paper presentations at the conference may be thirty or forty-five minutes in length. Some presentations may be grouped together in a forum or panel discussion. Workshops should be full day (8:30 a.m. to 4 p.m.) but half day (3 hour) proposals may be considered.
Papers, presentations and workshops must be non-commercial in nature, focusing on technology rather than a company's product.
PROCEEDINGS AND WORKSHOP HANDBOOKS:
Please note: It is mandatory for conference presenters to provide a print-quality paper or hard copies of visuals for the conference proceedings in order to deliver an oral presentation. The deadline for paper/visuals submission is July 31, 2000.
COMPLIMENTARY CONFERENCE REGISTRATION:
Presenters at IPCWorks 2000, HASLs of Assembling in the New Millenium, will receive full conference admission (includes refreshments, lunches and proceedings) at no charge.
TO SUBMIT AN ABSTRACT:
Please complete the following and include an abstract of 200 - 300 words along with a biography via
e-mail to [log in to unmask]).
The deadline for abstract and workshop proposal submission is June 1, 2000.
Proposed Presentation
IPCWorks 2000:
Complete and submit this form along with your biography and abstract to:
John Perry
Project Manager, Technical Programs
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax: (847) 509-9798 / E-mail: [log in to unmask] PLEASE DO NOT REPLY TO THIS E-MAIL WITH THE INFORMATION GIVEN BELOW AS IT IS COPIED TO ALL SUBSCRIBERS OF THE TECHNET FORUM.
Name :
Company :
Title :
Street Address :
City :
State/Zip Code :
Phone :
Fax :
E-mail :
Please include your 200 - 300 word abstract describing the presentation you wish to have considered for IPCWorks 2000:
Presentation Title:
Presentation Slot Desired:
30 Minutes
45 Minutes
Half Day Workshop
Full Day Tutorial
Indicate the general area of test technology:
Has this paper been presented before?
If yes, when and where?
Deadline for abstract and workshop proposal: June 1, 2000
Deadline for paper submission: July 31, 2000
Best Regards,
John Perry
Technical Project Manager
IPC
2215 Sanders Road
Northbrook, Il 60062
1-847-790-5318 (P)
1-847-509-9798 (F)
[log in to unmask]
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