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May 2000

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Subject:
From:
Michael Forrester <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 May 2000 14:19:48 -0400
Content-Type:
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     Recently we have been having problems with various PCB's from various
vendors.  After investgating the problems, what it has come down to is that we
are weak on our
pcb specifications.  In general we call out IPC-6012 Class 2, layer stackup,
soldermask (LPI or Dry film), lamminate material (FR-4 w/Tg 180), and white ink
silkscreen, and net electrical testing.
I have been told by our outside PCA vendor that they have seen as many as 50
pages of general PCB specs from one company.  I have heard that it calls out #
welds allowed, cleaness of PCB
before solder mask, max. weight of any single pkg of boards, etc..  I was
wondering if anyone is willing to sent me a copy of there general PCB
specifications so I have an idea of what
type of information is typically called out.  The information will be held in
confidence and deleted after I have had a chance to read it.

     In reviewing our past history on this subject it was thought that if we
pulled the PCB specs off the Fabrication drawing and placed it in a central
document that on future runs of
the same PCB, only the notes on the fabrication drawing would be looked at.  For
this reason we made them short and "sweet".  Any comments?  Thank you in
advance.


Best Regards,

Mike Forrester
LeCroy Corp.
Instrument Manufacturing Engineering

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