Hi All

I was hoping I could draw on your experiences

We have a customer who is convinced that the BGA to be soldered to his board
should be processed without any paste deposit, just gel flux and rely on the
solder ball providing enough solder to form a reliable joint.

The process would be Paste print, Gel Flux dispense, part placement then
reflow.

We have successfully reworked BGAs using just Gel flux and a Sniper rework
station, but I have never processed a BGA through a reflow process using
just a gel flux.

Any comments on potential non-conformances, experiences using such a
process?

Any help would be appreciated

Clayton Gardner
Engineering Manager
AEMS
11-13 Fiveways Blvd
Keysborough VIC 3173
AUSTRALIA

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