Actually we use RTV for its good dielectric properties, and not for its
moisture blocking capabiliteis.
The root of this problem lies in insuficient space for a given electrical
characteristics of a circuit. If one can not open up spacing, one must
resort to other techniques like routing the board in-between pads and
encapsulating.
As far as the conventional coatings go, we have found that in order to
prevent delamination we have to plasma etch boards as well. With rework
being easier with RTVs, we decided to use them instead.

Graham, I will e-mail you for more info on solventless or water based
coatins. How easy is the rework?

Jerry Mosur

Spellman High Voltage

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################