I agree with Tim There should never be silkscreen on a solder pad surface
mount or thru hole unless end user says it is ok

William W. DeCray III
Waytec Electronics Corp
Sales Engineer
PHONE:(804) 237-6391 ext 115
FAX:    (804) 237-1324
E-mail:<[log in to unmask]>
Web <http://www.waytec.com>
FTP <ftp://ftp.waytec.com>



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Timothy Reeves
Sent: Thursday, May 25, 2000 3:02 PM
To: [log in to unmask]
Subject: Re: [TN] Searching for IPC "marking" spec


Tom, Franklin:
IPC-A-600E (sec. 2.8.3) did say "no ink on surface mount lands" and
"acceptable on non-surface mount lands as long as it doesn't extend into the
part mounting hole or reduce min. annular ring".
IPC-A-600F is the same for non SM lands but no longer says anything about
ink on SM lands.
IPC-6012A (sec. 3.3.5) does say marking shall not cover areas of lands to be
soldered. That's the most restrictive and probably the spec we should
endeavor to meet.
So, I guess it can be as close as .0000 inches away from a land!
Tim Reeves

> ----------
> From:         Franklin D Asbell
> Sent:         Thursday, May 25, 2000 9:07
> Subject:      Re: Searching for IPC "marking" spec
>
> IPC-A-600 F should have what you're looking for, although I don't
> beleive in that document there is criteria for that
>
>
> Franklin
>
>
>
> "Hybiske, Tom" wrote:
>
> >
> >
> >
> > Was wonder if anyone can point me to the IPC spec which specifically
> > states how close silk screen marking on a printed wiring board can be
> > to land areas?
> >
> > Thanks,
> > Tom Hybiske
> > General Atronics Corporation
> > Wyndmoor, PA
>

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