Dennis,

You may want to try Flipchip Technologies. They provide a bumping service
(presumably you want to use 63/37 Eutectic).

Address is:

3701 E. University Drive,
Phoenix, AZ 85034
Tel:602 431.6020
Contact: Deborah Patterson

Martin Christie

===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
24/05/00 21:53
>I am looking for any information I can get about solder bumping with solder
>paste.  For example:
>
>How large should the stencil opening be compared to the pad the bump is
>going to be placed onto?
>Are there any general "rules of thumb" regarding the process?
>What can I expect the bump volume to be compared to the volume of the
>stencil opening?
>How repeatable can I expect my deposit to be?
>Is there a standard size for bumps (height, diameter, etc.)?
>Are there any major concerns with the process?
>
>I have gone through the information supplied to me by my paste vendor, but
>I am still a bit uncomfortable.  We are looking to use solder bumps as
>termination for one of our new products.  It will have four bumps on the
>bottom.  The chip is 2.5x3.0 mm in size.  Is four solder bumps going to
>provide enough rigidity?
>
>
>Any info would help.
>
>Thank You,
>Dennis Fall
>Thin Film Technology Corp.
>N. Mankato, MN
>
>P: 507-625-8445 x17
>
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