I am looking for any information I can get about solder bumping with solder
paste.  For example:

How large should the stencil opening be compared to the pad the bump is
going to be placed onto?
Are there any general "rules of thumb" regarding the process?
What can I expect the bump volume to be compared to the volume of the
stencil opening?
How repeatable can I expect my deposit to be?
Is there a standard size for bumps (height, diameter, etc.)?
Are there any major concerns with the process?

I have gone through the information supplied to me by my paste vendor, but
I am still a bit uncomfortable.  We are looking to use solder bumps as
termination for one of our new products.  It will have four bumps on the
bottom.  The chip is 2.5x3.0 mm in size.  Is four solder bumps going to
provide enough rigidity?


Any info would help.

Thank You,
Dennis Fall
Thin Film Technology Corp.
N. Mankato, MN

P: 507-625-8445 x17

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