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May 2000

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Subject:
From:
Scott Westheimer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 May 2000 18:51:15 +0800
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Excessive thermal cycle, unbalance core construction, unbalanced copper
area. sink wrap, and basically either temperature are construction issues
are involved
----- Original Message -----
From: "S. Miller" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 24, 2000 3:17 PM
Subject: [TN] Warpage (Bow and Twist) Causes


> Dear All,
>
> What could be the potential causes for warpage in a D/S PCB (unpopulated)?
>
> Any and all feedback would be truly appreciated.
>
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