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Tue, 23 May 2000 23:00:39 -0400
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me too...jk
At 05:48 PM 5/23/00 -0500, you wrote:
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>From: joyce <[log in to unmask]>
>Subject:      Re: [TN] SLC infor
>X-To:         Peter J Codella <[log in to unmask]>
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>
>Bret,
>here is a start:
>http://patent.womplex.ibm.com/details?pn=US05766825__
>good luck....
>                             jk
>At 05:56 PM 5/23/00 -0700, you wrote:
>>Bret,
>>
>>I believe that you call Multek/flextronics, Austin TX or IBM End. NY for the
>>data you are requesting. This technology was created by IBM years back.
>>
>>-----Original Message-----
>>From: TechNet [mailto:[log in to unmask]]On Behalf Of Brett Goldstein
>>Sent: Tuesday, May 23, 2000 1:49 PM
>>To: [log in to unmask]
>>Subject: [TN] SLC infor
>>
>>
>>   Can anybody recommend some good technical papers or other resources
>>which detail the SLC (surface laminar circuit) process, reliabilty results,
>>etc.?
>>
>>
>>Thanks for the help.
>>
>>Brett Goldstein
>>EVI, Inc.
>>
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