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May 2000

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Subject:
From:
Tom Burek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 May 2000 15:55:07 -0400
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Hello,
Can one of you experts out there or perhaps someone from IPC interprets what appears to be a contradiction.
IPC-SM-840C 3.5.2 Adhesion states that per table 2 a high reliability Rigid PCB that has a surface finish of Gold or Nickel can have a maximum 5% loss allowed on solder mask over a coupon per TM 2.4.28.1 of IPC-TM-650 (Tape test).
IPC-A-610 , 7.2 Coatings states a Non-conforming Defect- Class 1,2,3 Degradation of the mask film that permits solder bridging or exposed basis metal.

Can someone kindly differentiate the meanings?

Thank You,
Tom Burek
Product Engineer
[log in to unmask]

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