It was LPI; just a lucky choice rather than any foreknowledge - I can see
where dry would cause the problem you mentioned.

Gary Crowell
Micron Technology



-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Sent: Monday, May 22, 2000 5:41 PM
To: [log in to unmask]
Subject: Re: [TN] 4 oz Cu


In a message dated 05/22/2000 6:32:48 PM Central Daylight Time,
[log in to unmask] writes:

> I just did a 4oz, 4 layer power module at Advanced Circuits (www.4pcb.com)
>  and had no problems.  Minimum required spacing was 12 mils.  Silkscreen
>  tended to pool in the low spots between traces, but that was only really
>  visible on solid silkscreened areas.
>
>  Gary Crowell
>  Micron Technology

Hi Gary!

Just curious, was the soldermask LPI or Dry Film? As Mike Sewell said, we
had
a 4-oz copper board that used dry-film and had severe soda-straws...

-Steve Gregory-

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