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Subject:
From:
Richard Hamilton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 May 2000 12:23:25 -0700
Content-Type:
text/plain
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text/plain (90 lines)
Jason,

I don't know about anyone else, but this is a very interesting question from
my point of view. I had to stop and think about it. You did not specify, so
I am assuming you are thinking along the line of incoming inspection?

Anyway, if a plant has been receiving raw material for a long time, and has
a quality vendor evaluation program in place, there may be no raw material
testing done, until such time that bad received product happens.

On the other hand here is a sample of different in-process testing done on
individual components. All of which can be done to various levels.

Automatic Insertion: Individual component test to manufacturers
specifications. (value, tolerance)

In-Circuit Test: Individual component test to manufacturers specifications
once inserted in the assembly and soldered. (value, tolerance, under load)

Reliability Testing: Testing of the assembly under operation which has the
individual components loaded and they are exposed to real life temperature,
humidity, vibration and other environmental conditions  that may effect the
individual component.

Outside of these, I would expect that to do individual component testing you
would need equipment that would likely be found in a lab to test the
manufacturers specifications and to determine the 'good' envelope.

Take the zener diode for instance, you would need to apply a voltage range
that is both inside and outside the range of the manufacturers
specifications for that device to see if it really operates the way it is
supposed to. You would also want to test it loaded and unloaded, minimum and
maximum extremes. Etcetra!

The above examples are of course bound by the test facilities capabilities.
Most equipment on the market for production applications can do a good job,
but not a full blown analysis.

My 2cents. No need to return change! Time for lunch! Good Luck!

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

> -----Original Message-----
> From: Jason Larson, AScT [SMTP:[log in to unmask]]
> Sent: Friday, May 19, 2000 12:00 PM
> To:   [log in to unmask]
> Subject:      [TN] raw materials measurements
>
> Good day Technet,
>
> What are some typical tests used for raw goods analysis, in particular
> zener
> diode, capacitors and FET's?
>
> Thanks in advance
>
> Jason Larson
>
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