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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 19 May 2000 09:43:13 -0700 |
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Lou Hart
Sent: Friday, May 19, 2000 8:46 AM
To: [log in to unmask]
Subject: [TN] ASSY: soldering of standoff to PC board
TechNetters,
I'm looking at a what seems to me like a good sized piece of 303 stainless
steel, plated with nickel-tin, a standoff about 7 mm in diameter, 6 mm long,
with a wall thickness of about 1 mm. Using a metcal iron, our folks are
having trouble soldering this to a PC board. One of the quality inspectors
says there has not been a problem in the past, with this part, using the
metcal iron. The standoffs have been in stock for 1 year after nickel-tin
plating.
Here are two questions I think of:
(1) Is 1 year beyond the shelf life of nickel-tin plating? Operators think
there is a "coating" on the standoffs that inhibits soldering.
>Intermettalic Growth occurs on any tin - xxx plating, maximum shelf life
should be six months, I have had a interesting learning experience with
intermettalic growth and soldering
For further information take a look at the amp connectors site and search
the technical papers section for intermetallic growth
(2) Any ideas about a preferred soldering technique for a part like this?
Thanks for any feedback. All production supervisors are out for the day, so
QA is trying to handle this one...Lou Hart Compunetix
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