Yvon - I agree with Barbara and must respectfully disagree with Phil. You
will get statistically significant higher yields with solder mask between
the pads. It provides for a more robust process, in other words there is
more process latitude, in order to lessen bridging/shorting between the
leads. This is especially true when there is the slightest misregistration
during paste printing. Ed/
Ed Valentine
Electronics Manufacturing Solutions
8612 Mourning Dove Road, Raleigh, NC 27615
Phone: (919) 270-5145, Fax: (919) 847-9971
Email: [log in to unmask]
Website: http://www.ems-consulting.com
----- Original Message -----
From: Yvon Hache <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 17, 2000 3:43 PM
Subject: [TN] Soldermask between pads
Hello everybody out there,
We have a board where the footprint for a Plastic Quad Flat Pack 160pins
package has no soldermask between the pads. The pads are 1,6mm x 0,33mm and
the spacing center to center is 0,5mm. This board does not have any traces
running between these pads. Can this cause any problem in the board
manufacturing process and in the board assembly process? If yes, what would
be the recommendation? How close can the soldermask be to the pads?
thanks,
Yvon Hache, P.Eng.
Tel: 506-863-2467
Email: [log in to unmask]
Concept + Inc.
Scientific Park, Suite 100
55 Crowley Farm Rd,
Moncton, NB
E1A 7R1
Tel: 506-858-4153
Fax: 506-858-4075
Web: www.concept-plus.com
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