TECHNET Archives

May 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Quoc Khanh <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 May 2000 07:55:16 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (73 lines)
Steffen,

I believe that you can find another board material or maker whose warpage is
lesser because I found out that with the same manufacturing processes, the
warpage is different between makers (I am not sure they are using same
material or not) but in my opinion it is not the concrete counter for this.

You did not describe the warpage detail (warpage position, at which kind of
SMD etc.) so I could not think of any suggestion. However, the board design
is one important item you should confirm.

Hope it help.

Q. KHANH
-----Original Message-----
From: Steffen, Don E <[log in to unmask]>
To: <[log in to unmask]>
Date: Wednesday, May 17, 2000 3:34 PM
Subject: [TN] Board Warpage


>Technetters
>
>We are having a problem with board warpage. The board material is FR4. One
>board is double sided and the other is 4 layers. Appears that the double
>sided board warp more the four layer. We tried reducing the cooling portion
>of the reflow oven and this did not help. We are using paste that is a
63/37
>mixture so are using a normal thermal profile...... The question is: Is
>there board material out there in the industry that would warp less than
>others? Are there other process variations that we can consider to lessen
>the warpage? This board is depaneled via a punch versus a router. We have
>reduce the size and number of tabs in order to reduce any induced
>microstrains shocks in the circuit. I would appreciate any guidelines if
>there are any out there.
>
>Thanks
>
>Donn Steffen
>Wk# (219)925-8887
>Fax# (219)925-8710
>Email: [log in to unmask]
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
>information.
>If you need assistance - contact Keach Sasamori at [log in to unmask] or
>847-509-9700 ext.5315
>##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2