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May 2000

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Subject:
From:
Yvon Hache <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 17 May 2000 16:43:41 -0300
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Hello everybody out there,

We have a board where the footprint for a Plastic Quad Flat Pack 160pins package has no soldermask between the pads.  The pads are 1,6mm x 0,33mm and the spacing center to center is 0,5mm.  This board does not have any traces running between these pads.  Can this cause any problem in the board manufacturing process and in the board assembly process?  If yes, what would be the recommendation?  How close can the soldermask be to the pads?

thanks,


Yvon Hache, P.Eng.
Tel: 506-863-2467
Email: [log in to unmask]

Concept + Inc.
Scientific Park, Suite 100
55 Crowley Farm Rd,
Moncton, NB
E1A 7R1

Tel: 506-858-4153
Fax: 506-858-4075
Web: www.concept-plus.com

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