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Subject:	Speed of moisture absorbtion
From:	"d. terstegge" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 16 May 2000 17:00:07 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (42 lines)

Hi Technet,

I'm currently working on a handling procedure for moisture sensitive device. There's quite some information about this subject in the Technet-archives, but one thing I couldn't find is how quickly a component can absorb water from a cleaning operation. I mean, if we put our BGA-boards in our cleaning machine (which includes about 25 minutes spraying of hot water), can we still safely proceed with a second reflow step ?
And what if we have a paste misprint, and clean the board (with components on one side) in our solvent-filled stencilcleaner (Alpha SC1080) ?
Hope to hear from you !

Kind regards

Daan Terstegge
SMT Centre
Signaal Communications
Unclassified mail
Personal website: http://surf.to/smtinfo

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