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Subject:
From:
Mel Parrish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 15 May 2000 16:22:52 -0400
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The reference you mention in 610C was not intended as an encouragement to
use unsupported solder as a method of modifying circuit operations. The
statement actually began life as something like " an path between
electrically non common conductors". In committee discussion there were
cases illustrated to the effect that it could be intentional and if it was
then there should not be a mandatary reaction by the standard definition.
Additional definition is provided in J-STD-001C in paragraph 9.2.4.2, f
"Solder bridging between joints except when path is present by design" which
is pretty much the same as 610C.
I do not currently have access to reliability test data, although the tests
have been conducted and there should be information available from one of
the TNers.

Mel Parrish
[log in to unmask]
Mullica Hill, NJ

----- Original Message -----
From: Roger Mack <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, May 15, 2000 3:13 PM
Subject: [TN] Solder Bridging


> > Does anyone know of a reference in the standards that comments on
allowing
> > solder bridges as a method of jumpering two neighboring pins of smt
> > devices?
> >
> > IPC-A-610C section 12.4.9 describes the defect as "A solder connection
> > across conductors that should not be joined."
> >
> > Does this imply its ok if you wanted them joined? Are there any
> > reliability concerns with doing this instead of running wire?
> >
> >
>
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