TECHNET Archives

May 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Roger Mack <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 15 May 2000 14:13:54 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
> Does anyone know of a reference in the standards that comments on allowing
> solder bridges as a method of jumpering two neighboring pins of smt
> devices?
>
> IPC-A-610C section 12.4.9 describes the defect as "A solder connection
> across conductors that should not be joined."
>
> Does this imply its ok if you wanted them joined? Are there any
> reliability concerns with doing this instead of running wire?
>
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2