TECHNET Archives

May 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Douglas Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 15 May 2000 15:04:03 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines)
In a message dated 05/15/2000 11:08:45 AM US Eastern Standard Time,
[log in to unmask] writes:

>
>  In evaluating the susceptibility to dendritic growth, there is the
>  method for performing the test. My question is, is there data available
>  for comparison against the results I am documenting, or is this simply a
>  baseline establishment for individual processes/shops????
>

What results are you trying to document?  What is the goal of your testing?
Are you using it for process control or evaluating shops?

The test method itself is more to monitor the fabrication process.  This is
the IPC version of the ASTM comparative tracking index which someone asked
about last week.  You put a drop of water on an energized pattern and wait
for failure.  The cleaner the board, the longer the time to failure.

Doug Pauls
CSL

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2