Hi Technos,

thanks for the meaningfull answers to my OSP problem.

Now, there's something else, related to the same board. The PCB is
4.500"x12.350", .070" thick, with fine pitch on both sides. The design was
made to pass the board through the insertion line widthwise, that is like
this
 ________
|               |
|               |
|               |
|               |    --->
|               |
|               |
|               |
|               |
|________ |

or this is what the position of the tooling holes suggests, since they are
at the bottom in the above orientation. I need the tooling holes on my Fuji
CP machines. Besides that, along the vertical edges there are components at
less than .050" from the edges, so they won't pass through the rails.

My questions are: has anybody already run PCBs like this? Didn't the boards
get stuck in the transfer elements?
Also, I have to run it like this in the reflow, since in the other direction
there are components too close to the edges and they would get disturbed by
the chain. Since the assembly is heavily loaded with BGAs and micro BGAs
right in the middle, where the max warpage would occur, shall I attempt this
reflow orientation? Or I'd be better off building a jig and pass it in the
other direction?

Not to be mentioned is that it is about a critical prototype, no samples for
a test run, I have to get it right the first time and other nice challenges.

Thanks again,
Ioan

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