Martin,

its always the same component and the solderjoint looks like it is reflowed
again.

thanks

> -----Oorspronkelijk bericht-----
> Van: TechNet [mailto:[log in to unmask]]namens Martin Christie
> Verzonden: woensdag 10 mei 2000 13:35
> Aan: [log in to unmask]
> Onderwerp: Re: [TN] loose components
>
>
> Lon,
>
> What do the failed solder joints look like? i.e. do they look
> like they have
> suffered mechanical damage or have they gone through another
> reflow perhaps.
>
> Is it always the same component that fails?
>
> Martin
>
> ===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
> 10/05/00 12:02
> >Hi,
> >
> >Is one of you technetters familiar with this problem:
> >
> >For a customer we produce a board (3 by 5 centimeters)with no more then 6
> >smt components 1206. When they encapsule the board with a compound one of
> >the components looses from the board. They put the compound on the board
> >with 30-40 bar pressure and 150deg celsius temperature. It seems
> to me that
> >the preesure causes a higher temperature then 150 deg.
> >The customer says the soldering joints are bad , but we can't find any
> >solderingproblems at all.
> >
> >Thanks in advance
> >
> >Lon Weffers
> >Matas Electronics bv
> >De Dieze 16
> >5684PT Best The Netherlands
> >www.matas.nl
> >
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