Correct ass. Kelly :
Pasted board/resistors placed/compound bead across/sensor placed-seated
on/reflow.
Know it would be silicone base,
but don't want any to wonder down to board & joints.
Yo right the seat 's got to remain flexible,
not flowing in any temp state.
Any spec. specs ? No idea how much heat underfill transfers,
but sounds like the right way ; back to my sticky days.
Any underfill gurus ? can some take 250'C & reflow application ?

Fun days, right again         thx         pk

PS
Meant a French Fry (gettin woody in your woods)

-----Original Message-----
From: Kelly M. Schriver [mailto:[log in to unmask]]
Sent: Wednesday, 10 May 2000 22:16
To: [log in to unmask]
Subject: Re: [TN] Reflowable heat transfer compound


Mornin' PK and All -

On the assumption that you're talking about the air pressure sensor being an
electronic chip and not a chunk of firewood, what's the chance that one of
the underfill compounds might be satisfactory?  If the gap is relatively
thin, then most anything will do better than an air gap to allow heat
transfer.  One of the silicone resins might also be satisfactory if there is
a concern to avoid mechanical stresses during the operating life of this
item.

Have a fun day - regards - Kelly

-----Original Message-----
From: Paul Klasek <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, May 10, 2000 7:18 AM
Subject: [TN] Reflowable heat transfer compound


>Building this heater (stack of resistors) under a chip ,
>(to stabilize air pressure sensor)
>any leads please ?
>
>thanks a lot           paul
>
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