Hi,

Is one of you technetters familiar with this problem:

For a customer we produce a board (3 by 5 centimeters)with no more then 6
smt components 1206. When they encapsule the board with a compound one of
the components looses from the board. They put the compound on the board
with 30-40 bar pressure and 150deg celsius temperature. It seems to me that
the preesure causes a higher temperature then 150 deg.
The customer says the soldering joints are bad , but we can't find any
solderingproblems at all.

Thanks in advance

Lon Weffers
Matas Electronics bv
De Dieze 16
5684PT Best The Netherlands
www.matas.nl

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