ENIG stands for Electroless Nickel Immersion Gold

Very Best Regards
Roland

PCB Consultant - Company viability, Technical viability, Technology choice,
Yield improvement, Company Strategy, Equipment choice, Company acquisition
Roland Jaquet - Tel. +41-22-880-0405   -   Fax. +41-22-880-0409   -   Cell
+41-79-203-3723
http://members.xoom.com/rjaquet/index.htm
_______________________________________________________________________
----- Original Message -----
From: Douglas Pauls <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, May 08, 2000 9:47 PM
Subject: Re: [TN] OSP and Fine Pitch


> In a message dated 05/08/2000 11:50:47 AM US Eastern Standard Time,
> [log in to unmask] writes:
>
> >
> >  Just one question... are OSP users concerned with dendrite growth?
>
> All assemblers should be concerned about dendritic growth.  It doesn't
matter
> if it is tin-lead, copper-OSP, immersion silver, immersion tin, etc.
>
> >
> >  Isn't ENIG safer in regard of dendrite growth?
>
> Dunno.  What's an ENIG?
>
> Is it, by chance, a small heavy-set lowland bird which flies in ever
> diminishing circles crying Wango, Wango?
>
> Doug Pauls
> On yet another Mountain Dew binge............
>
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