Hi Jaime,

as a first source I checked the "IPC Roadmap for Lead-Free Electronics
Assemblies" 3rd draft Feb. 2000 and was astonished to find no indication of
an alloy composition for Sn-Ag-Cu at all.

As a second source I checked the ZVEI Leitfaden Bleifreies Löten
(Zentralverband Elektrotechnik und Elektronikindustrie/Germany Guideline
Lead-Free Soldering) Sept. 1999 and found (my humble translation:)
"Sn-Ag-Cu: The most important alternative solders of such composition
consist of ca. 0.5 to 2% Cu and 3.8 to 4.7% Ag. The melting point lies at
this composition between 216 and 219 °C."

Maybe someone else can post the internet download address for the 3rd draft
(or is there a forth available in the meantime?) for the IPC Roadmap? The
ZWEI Guideleine is available in print only, and only in german; the contact
e-mail address is [log in to unmask]

Hope this helps.

best regards,

Thomas Ahrens, Memellandstr. 8, D-24598 Boostedt
Tel. ++(49) (0) 4393 97769   e-mail [log in to unmask]
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-----Ursprüngliche Nachricht-----
Von: Jaime Gabriel <[log in to unmask]>
An: [log in to unmask] <[log in to unmask]>
Datum: Freitag, 26. Mai 2000 23:44
Betreff: [LF] SnAgCu


>Could someone please tell me in the alloy composition SnAgCu, what is
>the estimated min and max for % of Ag and Cu?
>
>Thank you,
>Jaime
>
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