Many suppliers offer pure tin plating solutions with a variety of support
data on tin whiskers.
Comparison of supplier data and refuting or confirming of the many tin
whisker growth theories is difficult to the lack of an industry-wide
standard whisker formation test.
With pure tin I don't believe it is prudent to speak of "whisker-free" but
rather minimization of the risk of whisker growth.
WIth 40+ years of research on tin whiskers, we can apply the results of
prior results and theories to develop plating processes which minimize the
risk of whisker formation.
Most theories agree that addition of an alloying element to tin greatly
reduces the risk of whisker formation and for this reason Pb-free Sn alloys
such as Sn-Cu have gained alot of attention, particularly in the Far East
(Japan & Taiwan).
I'll be happy to supply the specific results our company has obtained
relative to Pb-free plating and tin whisker formation off-line.  We plan to
present these as well at an upcoming Pb-free industry conference.

Rob Schetty
Shipley Co.
Shipley Ronal Division





John Lynch <[log in to unmask]>@IPC.ORG> on 05/23/2000 02:13:44 PM

Please respond to "Leadfree Electronics Assembly E-Mail Forum."
      <[log in to unmask]>; Please respond to John Lynch
      <[log in to unmask]>

Sent by:  Leadfree <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  Re: [LF] Japanese Regulations


i AM INTERESTED IN PURE tN AS THE COMPONENTS PLATING OF CHOICE FOR
ELECTRONIC COMPONENTS IN A LEAD-FREE ENVIRONMENT. wHAT SOLUTIONS ARE
AVAILABLE? WHAT DATA ON WHISKER MECHANISM AND GROWTH? cAN i BE SURE NO
WHISKERS WILL OCCUR??

jOHN lYNCH

"" wrote:
>
> In a message dated 00-05-23 12:17:10 EDT, you write:
>
> << Can anybody tell me if there is actually a Japanese law or regulation
that
>  specifically bans Pb in electronics and if so, where would I find a copy
in
>  English?
>
>   For you component suppliers out there, how would you interpret a
request
>  to respond to an OEM  customer to advise your compliance to the
"Japanese
>  Lead Elimination/Reduction requirements scheduled for implementation on
>  4/1/01" >>
>
> Nancy -
>
> Several of us from the US printed circuit industry attended a "Jisso"
> (complete packaging solution from silicon to system) meeting last week.
> There were 10 Japanese representatives and about 20 U.S.
>
> I understood that from the Japanese presentations on Lead Free, that
> "marketing" is the driver there.   That is "Green products are better
> products for the world".   They did not quote exact deadlines when lead
free
> must be implemented - just the prediction that it would take about 7
years in
> Japan to completely eliminate lead from electronic assemblies.
>
> Denny Fritz
> MacDermid, Inc.
>
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###############################################################
Please visit IPC's Center for Lead-Free Electronics Assembly
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