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May 2000

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Subject:
From:
Jonathan A Noquil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Jun 2000 09:42:25 +0800
Content-Type:
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Does anyone had experience to use 3D modeling software that analyzes thermal,
structural, etc (multi physics)
Any recommendation is highly appreciated

thanks


Jonathan A. Noquil
Package Design/Development Eng'r
Fairchild Semiconductor, PEZA
Lapu-Lapu City, CEBU
The Philippines

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