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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 30 May 2000 12:42:58 -0400 |
Content-Type: | text/plain |
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On a recent run of Ni/Ag boards (SM & PTH) we had solderability problems,
especially on the thru-hole components. Upon investigation by the board
manufacturer,
it was reported as a black nickel barrier problem. Apparently this is a
by-product of the immersion gold plating process. What exactly is it, what
causes it, and is there a way
to prevent it? Is there a way to "fix" a batch of boards with this problem?
Thank you.
Best Regards,
Mike Forrester
LeCroy Corp.
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