Hi Technet,

I'm currently working on a handling procedure for moisture sensitive device. There's quite some information about this subject in the Technet-archives, but one thing I couldn't find is how quickly a component can absorb water from a cleaning operation. I mean, if we put our BGA-boards in our cleaning machine (which includes about 25 minutes spraying of hot water), can we still safely proceed with a second reflow step ?
And what if we have a paste misprint, and clean the board (with components on one side) in our solvent-filled stencilcleaner (Alpha SC1080) ?
Hope to hear from you !

Kind regards

Daan Terstegge
SMT Centre
Signaal Communications
Unclassified mail
Personal website: http://surf.to/smtinfo

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