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April 2000

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Thu, 6 Apr 2000 14:18:55 -0700
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Timothy and Wang,

Wicking has been seen time and again by board fabricators. The following
factors may affect wicking during PTH plating -
1. Adhesion of epoxy to glass bundles/fibers. silane treatment of glass
fibers may be poor.
2. Stresses during hole drilling. Shattering of glass fibers may occur if
speed and feed ratio is not balanced for the spceific construction, drill
diameter, type of material being drilled.
3. Aspect ratio of the hole being drilled.
4. Drill geometry also affects as to how cleanly the material is being cut.
5. Smear removal may impact wicking depending upon how aggressive the
etchant is in attacking the epoxy.
6. Lamination process may also contribute depending upon the quality of
B-stage bonding layers, epoxy flow etc.

A carefully look at the xsection may reveal where the wicking is occuring,
in bonding plies or the copper laminate ply. If in the bonding ply area,
then composite lamination/laminator need to be looked. But if the copper
laminate area shows wicking, then contact the laminate supplier for help.
But if the hole looks rough, first start with drilling process and drill bit
investigation.
----- Original Message -----
From: "Timothy Reeves" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 06, 2000 10:55 AM
Subject: Re: [TN] Laminate porosity


> I am quite interested in this problem, too. We had two lots of clad
laminate
> which suffered from quite a bit of haloing after it was drilled, and I had
> it tested for resin content and Tg by DSC. The results were OK. I suspect
a
> problem with the glass treatment (I don't know what else to suspect), but
> don't know how to find out if this is the problem. The supplier is large
> (and shall remain unnamed) and is taking their time to give an answer. Any
> ideas?
>
> Timothy Reeves
> ECD Circuit Board Division
> 13626 South Freeman Road
> Mulino, OR 97042
> (503) 829-9108 (800) 228-8198  FAX (503) 829-5482
>
>
> > ----------
> > From:         Wang, William (Suzhou Laminate)
> > Sent:         Thursday, April 6, 2000 11:31
> > Subject:      Laminate porosity
> >
> >      I work for a copper clad laminate manufacturer. One of our customer
> > (PCB shop) has wicking problem for plated through hole. They said they
> > found
> > "laminate void in glass fabric " by microsection. (They mean the glass
> > yarns
> > are not wetted by epoxy resin, not void in resin after lamination.
Usually
> > wicking is related to rough drill or over desmear process). I made
> > microsection by myself and make real good polish. After that I believe
the
> > so called "laminate void in glass fabric" is the result of poor
polishing
> > i.e. scratches. (My microsection can see a single yarn but their
> > microsection can't). I attached some detail dimension for your
reference:
> >     Glass yarns diameter: 1080 (5 microns), 7628 (9 microns)
> >     Extect abrasive paper P1200 grit: grit size 10 to 20 microns,
average
> > 15
> > microns
> >     Multipolish Al2O3: 0.05 microns
> >     Specification for laminate void is < 3 mil. (IPC-4101 & MIL-PRF-5510
> > F).
> > Our product is 5 mil laminate so the "laminate void will be far less
than
> > 3
> > mil.)
> >     My customer show us a article dated at August 1982 by PC FAB,
> > "Laminate
> > Porosity Causes". But the pictures are too blur after copy many times.
The
> > authors are J.F. Nejedlik and A.M. DeSantis.
> >     My questions are as follows:
> >     1. Anyone has the experience of "wicking" or "blow hole" due to the
> > wetting problem of glass fabric?
> >     2. Is microsection technic with 100 X to 200 X magnification capable
> > of
> > tell the wetting condition of single yarn of glass fabric?
> >     Any inputs will be greatly appreciated!!!
> >
> >     William Wang
> >
>
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