Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 6 Apr 2000 10:02:31 EDT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Jason,
You should start with IPC-SM-785, Guidelines for Accelerated Reliability
Testing of Surface Mount Solder Attachments, and IPC-D-279, Design Guidelines
for Reliable Surface Mount Technology Printed Board Assemblies, particularly
Appendices A & B. And then, Steve Gregory's advice is a pretty good one (if I
say so myself, thanks Steve).
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|