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April 2000

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Apr 2000 15:59:02 +0200
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Hi again, Bruce.
Came to think about your comment below.

Create microcracks: you mean 'cratering' ?
microcracks or worse: WORSE?... What could be worse ! I'm really curious about your reply.

Ingemar



Wire bonding is atypical as well.  Ultrasonics tend to create microcracks or
worse and should be minimized.

 Best of Luck, they're a challenge,

Bruce Misner

>

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