My company uses the same methods described.  The suppliers or your MRP
should be able to define a minimum order quantity in the system.  We use
panels of 2, 5, and 6 parts.  Designers issue a seperate drawing indicating
the array form(break away method, rail size etc.).  But we order in units,
we build in units, and we sell in units.  But there is a minimum set
requirement depending on how many units are in the array.

The danger is be sure to be able process boards outside of panel form.  We
are currently having a problem in electrical test where the test fixture was
designed to test 2 units in an array.  If 1 board fails the other one is
considered scrap because our trace system tracks the 2 units together until
final packaging.  I know it is a stupid system.  we are trying to change it.

Anyways good luck because it can be done.
Brian
NatSteel Electronics
Hillsboro, OR



-----Original Message-----
From: KK Chin [mailto:[log in to unmask]]
Sent: Tuesday, April 04, 2000 3:52 PM
To: [log in to unmask]
Subject: Re: [TN] Panelization of Board v/s MRP system


My MRP system is SAP R3. We set the "rounding value" in the material master
to
the quantity per panel. That way MRP will drive the PO quanttity in the
multiple
of the quantity per panel. I saw another MRP package called the "rounding
value"
"pan size".

K.K. Chin
Artesyn Technologies
Fremont, CA

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