question:
(1) what kind of flux?
(2) what is the time delay between soldering and cleaning?
(3) Is your cleaning process continuous tank or batch? (sound like 3 tank
system, but I could be wrong).
(4) can you check the pH of the cleaning solution of the 1st tank?
                                     jk
At 03:13 PM 4/30/00 +0300, you wrote:
>Dears,
>
>Below is a short description of a problem we have faced recently at our
>plant with the Through/Hole assemblies.
>
>Problem: Unacceptable formation of rust (brown to red color) on the CCA just
>after cleaning (before and after wave solder)
>Location: Exactly at the cutting edge of the T/H components leads (most of
>the T/H components)
>Process used: Semi-Aqueous cleaning (Prozone wash 45?C, Prozone/tap water
>rinse 45?C, DI water rinse 50?C, then hot air forced drying 110?C)
>
>What could be the reasons for this problem and what do you recommend to
>solve it and to prevent re-occurrence.
>
>Your expected useful response is highly appreciated in advance.
>
>Best regards,
>
>Yousef Almotlaq
>Manufacturing Engineer
>
>Advanced Electronics Company - Saudi Arabia
>
>Email [log in to unmask] <mailto:[log in to unmask]>
>Tel  + 966 1 220 1350 X 3215
>Fax + 966 1 220 1355
>
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