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April 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 28 Apr 2000 19:01:28 EDT
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In a message dated 04/28/2000 4:13:57 PM Central Daylight Time, TheITMTeam
writes:

> Steve-
>  This might be a case of "you gets what you pays for" and might be one of
the
> differences between the low-cost x-ray systems, and the more powerful,
higher
> resolution systems, like CR and others.  You might try examining the part
> with a CR and see what results.  We'll stay tuned!
>  I also think one needs the a resolution of at least 10 microns in order to
> determine if voids are in the 20-25% range and I don't think you get that
on
> a benchtopper.
>  Regards,
>  Phil Zarrow
>  ITM, Inc.
>  Durham, NH

Yep Phil...agree with you. But this system was bought here before my time.
What we've been using it for in the past though, is gross defects and
placement accuracy.

One thing that is ironic about this deal today, is that last week a rep out
here demo'ed a Ersascope for me and another engineer at my company...we both
think that in your words; "Is the neatest thing since sliced bread..." We
took one of the same assemblies that we were building today (but a scrap
assembly due to a fab problem internally), that had the old part on it. I was
almost afraid to look beneath it.. (GRIN). To my relief, things looked pretty
good!

Came back and talked to management about the Ersascope after we looked and
played with it, and told them what a great tool it was. They were listening
up until we told them what the price tag was...they then cooled.

But after what happened today, and me telling them that the Ersascope
could've solved the problem today, they are getting interested again. I also
added that the Ersascope could give us the means to measure solderpaste
height, something that we're not capable of now.

Funny how things work, ain't it?

Still got the problem of the heavy TI DSP squishing the balls flat though...

-Steve Gregory-

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