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April 2000

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 28 Apr 2000 11:27:20 +0300
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text/plain (88 lines)
Mike

Was this gold-on-gold bonding, aluminium or what? I'm not an expert on plasma cleaning, but I was
given to understand that an oxidising gas is used which converts organics to CO2 and H2O. As O, as
opposed to non-ionised O2, is a violently reactive substance, this reaction occurs easily, but,
equally, M + O > MO (where M is a base metal). Or am I up the pole?

Brian

Michael Fenner wrote:

> I was peripherally involved in this some years ago with a company looking to improve wire
> bonding and cleanliness generally. A half an eye was kept on solderability "just in case."
> They noted that the type of plasma cleaning, had a noticeable effect on whether surfaces became
> more or less wirebondable, but where the work became more bondable there was no change in
> solderability. We put this down to the  fact that whether there  was a little oxide, non or a
> lot the flux had more than adequate capability to remove it anyway. However if the plasma type
> chosen made wirebonding worse it also screwed solderability. We put this down to the fact that
> the plasma was chewing off organics and then allowing them to be re-deposited. As this was a
> side issue and not the object of the exercise it was not investigated and remained a surmised
> comment in the footnotes.
>
> Hope this helps.
>
> Mike
>
> ----- Original Message -----
> From: Brian Ellis <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, April 27, 2000 11:41 AM
> Subject: Re: [TN] Solderability
>
> > Raj
> >
> > No, but it's an interesting thought. I should imagine that some types of
> > plasma could be quite active towards oxidising base metals.
> >
> > Brian
> >
> > Rajkumar wrote:
> >
> > > Hello everyone Hope everyone had a good easter break. I need to know,
> > > if anyone is working on solderability degradation after plasma
> > > cleaning? RegardsRajkumar
> >
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