I was peripherally involved in this some years ago with a company looking to improve wire
bonding and cleanliness generally. A half an eye was kept on solderability "just in case."
They noted that the type of plasma cleaning, had a noticeable effect on whether surfaces became
more or less wirebondable, but where the work became more bondable there was no change in
solderability. We put this down to the  fact that whether there  was a little oxide, non or a
lot the flux had more than adequate capability to remove it anyway. However if the plasma type
chosen made wirebonding worse it also screwed solderability. We put this down to the fact that
the plasma was chewing off organics and then allowing them to be re-deposited. As this was a
side issue and not the object of the exercise it was not investigated and remained a surmised
comment in the footnotes.

Hope this helps.

Mike

----- Original Message -----
From: Brian Ellis <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 27, 2000 11:41 AM
Subject: Re: [TN] Solderability


> Raj
>
> No, but it's an interesting thought. I should imagine that some types of
> plasma could be quite active towards oxidising base metals.
>
> Brian
>
> Rajkumar wrote:
>
> > Hello everyone Hope everyone had a good easter break. I need to know,
> > if anyone is working on solderability degradation after plasma
> > cleaning? RegardsRajkumar
>
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