Craig,
        See IPC-A-610B Rev B, Section 4.2.1, 'Exposed Basis Metal'. There is
a note that addresses OSP and exposed copper. Even without applying the
note, it is still considered only a process indicator rather than a
nonconforming defect.

        If you are already working to the new release of IPC-A-610C, it is
covered in better detail in Section 6.5.2, 'Exposed Basis Metal'.

Mike McMonagle
PCBA Process Engineering
Telxon Corporation
(713) 307-2443 Phone
(713) 307-2581 Fax
www.telxon.com

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-----Original Message-----
From: Craig Leppanen [mailto:[log in to unmask]]
Sent: Thursday, April 27, 2000 7:47 AM
To: [log in to unmask]
Subject: [TN] spec for exposed copper


All-

I have a situation on an SMT OSP board.  There is some exposed copper on the
periphery of fine pitch lands.  The lands have greater than 85% solder
coverage
and acceptable joints.  But the customer is concerned about the exposed
copper.
I have not seen a spec explicitly stating that exposed copper on an OSP
board is
acceptable.  Does such a spec exist??

Thanks, Craig Leppanen

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